Qianhe Yibang, a 3D compute-in-memory chip enterprise, has completed its Series B financing of more than 2 billion yuan.

Recently, Qianhe Yibang, an enterprise specializing in 3D computing-in-memory chips, announced the completion of a Series B financing of over 2 billion yuan. 

Against the backdrop of China accelerating the high-quality development of the integrated circuit industry and strengthening independent innovation of key core technologies, innovative enterprises with independent R&D capabilities that explore new chip architectures are becoming an important force driving industrial upgrading. Meanwhile, the global digital economy has entered a new stage with computing power as the core driving force, and storage technology is facing demand challenges for higher bandwidth, lower latency and larger capacity. By breaking through the limitations of traditional chip architectures, 3D integration technology realizes the deep integration of computing and storage, and has become a key direction promoting the innovation of next-generation semiconductor technologies. 

Founded in January 2024, Qianhe Yibang is a domestic chip company incubated by NetEase that was among the first to focus on 3D computing-in-memory, native 3D-integrated chip architectures, and cloud gaming application acceleration. Back in 2018, the company's core team took the lead in launching the R&D and mass production of the world's first chip based on 3D DRAM computing-in-memory architecture, and promoted the full application of native 3D-integrated chip architectures in the fields of encrypted computing power and application acceleration. It is a pioneer and leader in native 3D-integrated chip architectures and 3D DRAM computing-in-memory chips. 

Qianhe Yibang is committed to promoting the new paradigm of native 3D-integrated chip architectures and 3D computing-in-memory chips. Starting from the underlying layer, it combines the joint innovation of system software stack and hardware architecture, and realizes the deep integration of computing and storage in three-dimensional space through 3D DRAM stacking. It has taken the lead in embarking on a new path to cope with the increasingly prominent Memory Wall bottleneck, breaking through the performance limitations caused by the separation of storage and computing under the von Neumann architecture, realizing overtaking on a new track, and devoting itself to the integration revolution brought by future 3D integrated circuits. 

The investor lineup of this round of financing brings together a premium combination of industrial capital and financial capital, including many well-known first-tier institutions such as the national-level fund China Structural Reform Fund, China Mobile Industrial Chain Leader Fund, Himalaya Capital, StarLian Capital, Stony Brook Capital, GPC Investment, Nanshan Capital, Hundun Capital, Chenyi Huizhi, Guoce Investment, Guoxin Venture Capital, and Gezhi Capital. It is worth noting that NetEase Youdao and China Mobile Industrial Chain Leader Fund, as long-term shareholders of Qianhe Yibang, have continued to provide strong support since the company's establishment, formed deep business synergy with the company, and provided solid demand entry points and verification scenarios for the large-scale implementation of chips. This financing further strengthens the strategic synergy between industrial capital and Qianhe Yibang in business scenarios. The company will continue to increase R&D investment, promote product iteration and commercialization, and continuously break through the cutting-edge core technologies in the fields of native 3D-integrated chip architectures and 3D computing-in-memory chips.