Huafeng Jixin completed the financing delivery of 300 million yuan to accelerate the industrialization process of high-end advanced packaging.

Recently, Beijing Huafeng Jixin Electronic Co., Ltd. (hereinafter referred to as "Huafeng Jixin") announced the successful completion of the Series A financing of 300 million RMB. This round of financing was jointly invested by multiple investment institutions with profound industrial backgrounds, including Beijing High - tech and Advanced Industry Development Fund, Puquan Capital (CATL), Zhongchuang Juyuan Fund, GF Xinde, Zhiwei Capital (AMEC), and Nachuan Capital, marking that the company has gained high recognition from the capital market in terms of its technical path, engineering implementation capabilities, and industrialization prospects.

It is worth noting that this equity financing is not the only financial support Huafeng Jixin has received recently. In 2025, the company successfully completed the signing of a syndicated loan totaling 2.3 billion RMB, led by the Agricultural Bank of China and jointly formed by seven financial institutions, including the Postal Savings Bank of China, China Construction Bank, and Bank of China. This series of financing measures demonstrates the dual confidence of financial and industrial capital in Huafeng Jixin's strategic positioning and development potential.

Integration of Industry and Finance to Support the Construction of Key Links in the Industrial Chain

This round of financing will be specifically used for the technological R & D of 2.5D/3D advanced packaging and integrated chips. Meanwhile, the previously obtained 2.3 - billion - RMB syndicated loan has been fully invested in the construction of a high - end packaging production base in the Beijing Economic - Technological Development Area, covering core infrastructures such as the FCBGA packaging platform, high - density bumping production line, and 2.5D/3D advanced packaging production line.

"What Huafeng Jixin has obtained is not just a round of financing, but also dual credit certifications from the industrial and financial systems," said the person - in - charge of the company's government affairs center. "As a high - end packaging enterprise with key layout in Beijing's integrated circuit industry, we shoulder the important mission of achieving breakthroughs in the 'bottleneck' areas. These two rounds of financing will jointly support our full - chain capacity building from technological R & D to large - scale production."

Technological Breakthroughs to Create an Independently Innovative Packaging Architecture

Huafeng Jixin has gathered a top - notch technical team from the global semiconductor industry and has accumulated profound experience in key areas such as bridge chip design, process R & D, simulation, and mass - production manufacturing. It has successfully launched the high - performance, high - yield "Huafeng Bridge" 2.5D/3D Chiplet packaging architecture.

This technology effectively breaks through the technical bottlenecks of high bandwidth, high density, and high - speed response through an innovative high - density interconnect (HDI) solution and advanced heat dissipation design, providing a key performance improvement platform for high - performance computing chips such as artificial intelligence (AI), graphics processing units (GPU), and central processing units (CPU). It has become one of the important paths to continue Moore's Law and address the "memory wall" challenge.

2026: A Crucial Year for Moving towards Large - Scale Value Delivery

Currently, the construction of Huafeng Jixin's high - end packaging and testing base in the Beijing Economic Development Area has entered the final stage, and the completion acceptance work is about to be fully launched. The company plans to achieve mass - production delivery of the first batch of customer products within 2026, officially completing the strategic transformation from "capacity building" to "value delivery."

In the context of the explosive growth of demand for artificial intelligence and high - performance computing, advanced packaging technology has become a core link in improving chip performance and ensuring supply - chain security. Taking this round of financing as an opportunity, Huafeng Jixin will accelerate the industrialization process, actively play the role of the "chain leader" in the industrial chain, and contribute to the construction of an independent, controllable, safe, and reliable semiconductor industrial ecosystem.