Focusing on full-stack microsystem solutions, "Realmems Semiconductor" has obtained a new round of tens of millions of financing | HardcoreTech exclusively reports.

Author | Ye Danxuan

Editor | Yuan Silai

HardcoreTech has learned that "Raymond Semiconductor", a full-stack sensing and actuating microsystem solution provider, has recently received another investment of tens of millions of RMB in the pre-A+ round, led by China Growth Capital and Huashan Capital. The financing funds will be mainly used for the research and development of new sensing and actuating microsystem products and the construction of a pilot production line.

Up to now, Raymond Semiconductor has obtained multiple rounds of financing, with a cumulative financing amount of over 100 million yuan. Historical investors include Yuanchi Capital, Shenzhen Hi-Tech Investment, Qingsong Fund, Huashan Capital, China Growth Capital, etc.

Since its establishment in 2020, Raymond Semiconductor has focused on the research and development of microelectromechanical systems such as intelligent tactile perception and feedback, heat dissipation micropumps, and ultrasonic motors. With an independent piezoelectric material system, microelectromechanical structure design, and advanced manufacturing processes, combined with self-developed sensing and actuating driver chips and algorithms, it has formed a full-stack technology platform of "materials + devices + chips + algorithms", and has reached long-term cooperation with domestic leading manufacturers and achieved stable shipments.

In recent years, autonomous driving, large models, embodied intelligence, etc. have developed rapidly, and intelligence is becoming an irreversible trend. In response to this situation, Dr. Li Bing, the founder of Raymond Semiconductor, regards perception and execution as the core of the implementation of intelligence in product terminals.

Based on this, Raymond Semiconductor has focused on the 3C electronics and intelligent vehicle scenarios that the company's business focuses on, and has laid out four major product lines with perception and execution as the main functions. Through the self-developed full-stack technology platform, it realizes an intelligent system with multi-functional coordination to provide customers with a full-stack microsystem solution.

Smartphone Layout

Intelligent Vehicle Layout

It is understood that the four major product lines of Raymond Semiconductor are Tactile Perception and Feedback MagicTa, Piezoelectric Heat Dissipation Micropump MagicCool, Piezoelectric Ultrasonic Motor MagicEng, and Piezoelectric Ultrasonic Cleaning MagicClear.

The piezoelectric ultrasonic motor is a driving component that provides power based on the ultrasonic motion mode and is mainly used in the autofocus system of cameras. Traditional VCM (Voice Coil Motor) and SMA (Shape Memory Alloy) have small thrust, slow response speed, and short operating stroke, which have gradually been difficult to meet the requirements for telephoto and fast zoom functions in scenarios such as surveillance cameras and mobile phone cameras. After connecting to Raymond Semiconductor's MagicEng full-stack high-precision piezoelectric ultrasonic motor microsystem, not only can high-precision focusing be achieved through the self-developed high-precision closed-loop motion control algorithm, but also the power-off self-locking function can be realized, and it can work normally in complex high-frequency vibration scenarios such as bumpy roads and aerial photography.

Full-Stack Piezoelectric Heat Dissipation Micropump

HardcoreTech notes that with the continuous improvement of the computing performance of various terminals, heat dissipation is becoming an important factor restricting terminal iteration. Dr. Li Bing, the founder of Raymond Semiconductor, told HardcoreTech that currently, 3C digital terminals generally use passive heat dissipation such as graphite heat conduction. However, as the ultrathin trend of digital terminals becomes mainstream, traditional passive heat dissipation devices are difficult to meet the requirements of miniaturization. Therefore, in response to the market demand for active heat dissipation, Raymond Semiconductor has launched the piezoelectric heat dissipation micropump, which adopts a multi-layer piezoelectric ceramic process. With its own independent intellectual property pump body and fluid structure, and integrated real-time characteristic spectrum tracking algorithm, it has the advantages of high back pressure, high flow rate, and ultra-silent operation. It can be easily integrated into micro devices such as mobile phones and ultra-thin laptops to provide high-energy-efficiency heat dissipation performance.

Currently, Raymond Semiconductor is targeting the 3C digital and automotive fields and has reached cooperation and commercial application with more than ten leading enterprises in the industry. The company is simultaneously launching a new round of financing.

Investor's Perspective:

Chen Huan, a partner of China Growth Capital, the investor in this round, said that the era of general artificial intelligence has brought unprecedented opportunities for new AI intelligent hardware interaction innovation and precise control execution technology. We are optimistic about the broad application prospects of Raymond Semiconductor's full-stack sensing and actuating microsystem capabilities in various fields in the AI era. Raymond Semiconductor integrates the end-to-end process from materials, devices, chips to algorithms to create a diverse product line, covering various scenarios such as consumer electronics and automotive intelligence. We look forward to Dr. Li Bing leading the company to conduct a comprehensive and in-depth layout to fully release the huge potential of piezoelectric sensing and actuating technology in the era of general artificial intelligence.

Du Bo, the Managing Director of Huashan Capital, the investor in this round, said that the development of generative artificial intelligence has accelerated the innovative iteration of various intelligent terminals such as automobiles, mobile phones, PCs, XR, and robots with AI, bringing unprecedented opportunities and challenges to perception interaction technology, precise control execution technology, low-power consumption and heat dissipation technology. It is the most innovative and promising technical direction in our investment puzzle of artificial intelligence underlying base technologies in addition to the well-known "computing power, storage power, and transportation power". Under the leadership of Dr. Li Bing, Raymond Semiconductor has built its own unique full-stack sensing and actuating system technology platform by integrating fully self-developed piezoelectric materials/devices, self-developed chips and AI algorithms. It has launched a series of unique and leading innovative products and solutions in the fields of "perception, execution, and heat dissipation" for various AI intelligent terminals, with huge application prospects and potential. We look forward to Raymond Semiconductor's products enabling various AI intelligent terminals and accelerating the arrival of the intelligent era.