New Sound Semiconductor completed nearly 300 million yuan in Series C financing with strategic investment from Shengyi Circuit Technology.
Recently, Shenzhen New Sound Semiconductor Co., Ltd. (hereinafter referred to as "New Sound Semiconductor") successfully completed the delivery of a 269 million yuan Series C financing. In this round of financing, the leading automotive-grade PCB company, Shiyun Circuit (SH: 603920), and its affiliated company, Shunke Juxin, made a strategic investment of 249 million yuan in total. The old shareholder, Hongsheng Capital, additionally invested 20 million yuan. Huachuang Capital led the Series A+ financing of New Sound Semiconductor.
This capital cooperation not only injects impetus into the expansion of New Sound Semiconductor's automotive-grade market but also opens a new chapter in the industrial chain collaboration between the leaders of the two sub - fields of filters and PCBs. It is of great significance for the large - scale and diversified application of domestic filters.
New Sound Semiconductor is a leading enterprise in the domestic filter field, with profound accumulation in technology R & D and commercialization. It has been stably supplying well - known domestic and international brands such as Xiaomi, Honor, Samsung, and Motorola. Especially in the two major mainstream high - end markets of BAW and TC - SAW, New Sound Semiconductor's product performance and shipment volume have gained obvious advantages in the domestic competition.
It is worth mentioning that New Sound Semiconductor is also the first domestic filter enterprise whose products have passed the AEC - Q200 automotive - grade certification. It has achieved mass production and shipment of multiple automotive - grade filters, which is also one of the important reasons for Shiyun Circuit to invest in New Sound Semiconductor.
Shiyun Circuit is the leading enterprise in the domestic automotive - grade PCB field and has become the core PCB supplier for mainstream domestic and international new energy vehicle brands such as Tesla, BMW, Volkswagen, Porsche, Mercedes - Benz, XPeng, GAC, and NIO. Relying on the stable customer resources, mature supply system, and PCB integrated design capabilities accumulated in the automotive - grade field, Shiyun Circuit has become a key hub connecting components and vehicle manufacturers in the industrial chain, providing a solid foundation for the collaborative cooperation of upstream and downstream enterprises.
For New Sound Semiconductor, the value brought by this round of financing is reflected in the dual dimensions of market breakthrough and service upgrade. In the automotive - grade field, relying on Shiyun Circuit's profound vehicle manufacturer resources, New Sound Semiconductor's automotive - grade filters will enter the "fast lane" of the pre - installation market, significantly shortening the cycle from product certification to mass supply, efficiently reaching terminal vehicle manufacturers and completing product introduction, and accelerating the large - scale penetration of the automotive pre - installation market.
At the same time, the capital injection will further strengthen New Sound Semiconductor's service capabilities for domestic ODM manufacturers and consumer electronics terminal customers, enabling it to more accurately respond to the continuously evolving technical requirements of customers in the process of chip localization. Through more efficient technical support and supply chain guarantee, it will help terminal customers break through the "last mile" of localization.
Through this strategic investment, Shiyun Circuit will also extend and enhance the value of the industrial chain. As the leading enterprise in the automotive - grade PCB field, Shiyun Circuit has accumulated channel resources and supply qualifications of mainstream domestic and international new energy vehicle brands. By binding with New Sound Semiconductor, it can deeply integrate its business with filters, a core automotive component, forming the ability to provide an integrated "PCB + filter" solution. It will jointly develop new modular products suitable for the needs of intelligent vehicles, further consolidating its competitive advantage in the automotive - grade PCB field and expanding its business growth space.
The synergy between the two parties will focus on the efficient implementation and technological integration in the automotive - grade market. The two - way empowerment of channel potential and local innovation capabilities will systematically reduce the risk of market expansion, compress the technology transformation cycle, and form a virtuous cycle, helping both parties build a competitive barrier in the intelligent era of accelerated development of AI hardware and applications.