Connecting Chains to Form Chapters, Empowering the Semiconductor Industry with Cutting-Edge Technology: The Special Session of the "X-Day" Xili Lake Roadshow Society for the Semiconductor and Integrated Circuit Industry Was Successfully Held

On September 4th, the special event of the X-Day Xili Lake Roadshow Society for the Semiconductor and Integrated Circuit Industry was successfully held at the International Conference Center of Shenzhen University Town. This event focused on the core area of the national strategy of semiconductors and integrated circuits, bringing together enterprises from the upstream and downstream of the industrial chain, leading investment institutions, and industry experts to promote the in - depth connection between technological innovation and capital.

Government, Enterprises, and Investment Institutions Gather; Distinguished Guests Jointly Outline the Industrial Blueprint

The event boasted a strong lineup of guests. Representatives from the government and the industry discussed development together: Liu Xing, the Deputy President of the Shenzhen Branch of China Construction Bank; Gu Jinlong, the Party Secretary and President of the Shenzhen Branch of Hangzhou Bank; Chen Xiangming, the Founder and Chairman of Ginkgo Valley Capital; Lin Haizhuo, the Founding Partner and Chairman of Zhuoyuan Asia; Ren Le, the person - in - charge of Zhongtou Capital; Shu Qing, the Partner of Tongchuang Weiye; Duan Zheming, the Managing Director of SMIC Juyuan; Ren Gang, the Executive Director of Vertex Ventures; Gu Huaihuai, the Team Leader of the Information Technology Group in the Greater Bay Area Investment Department of Shenzhen Capital Group; Liu Huarui, the Vice President of Hechuang Capital; and Shi Feng, the Assistant General Manager of the Shenzhen Branch of China Life Property Insurance, served as the commenting guests and attended the event together.

Meanwhile, representatives from over a hundred investment institutions, banks, insurance institutions, enterprises in the semiconductor and integrated circuit industrial chain, as well as experts and students from universities and research institutes came to the scene to witness the cutting - edge innovation and breakthroughs of science and technology enterprises.

Roadshows of Six Cutting - Edge Projects Demonstrate China's Semiconductor Innovation Strength

During this roadshow, six high - quality enterprises focusing on the core segments of semiconductors made their appearances one by one, covering key areas such as chip design, EDA tools, advanced packaging, third - generation semiconductors, and storage IP, showcasing the innovation vitality and technological potential of China's semiconductor industry:

Lingming Photonics was founded in May 2018 by a team of returnee doctors. Its headquarters is located in Nanshan, Shenzhen, and it has a R & D center in Zhangjiang, Shanghai. The R & D personnel account for over 80% of the total. The single - photon avalanche diode (SPAD) designed by the company is the core device that enables modern electronic devices to achieve 3D perception, widely empowering fields such as automobiles, smartphones, robots, automatic control, human - computer interaction, and smart homes. The company offers a series of SPAD dToF sensor chip products with top - level accuracy, energy - efficiency ratio, and ranging scope in the industry.

Chuangfei Core has its headquarters in Zhuhai Tsinghua Science Park and R & D institutions in Silicon Valley, Beijing, etc. It provides independently controllable semiconductor storage IP and IC solutions. The team has experience working in international leading companies such as Intel and AMD. The founder has over 20 years of in - depth R & D experience in Silicon Valley. It has served leading customers such as HiSilicon and BYD Semiconductor and closely cooperates with major domestic wafer fabs such as SMIC and Huahong.

Zhongzeng Semiconductor focuses on the special process of compound semiconductor etching. It is a high - tech enterprise dedicated to the manufacturing of special equipment for semiconductor devices and process R & D. The company's core products are plasma dry etching equipment and process recipes, providing customers with an integrated solution of "equipment + process" joint delivery.

Weihe Technology is a high - tech enterprise focusing on providing leading 5G communication and edge - side AI (5G + AI) chip solutions. It was established in August 2022, with its headquarters in Shenzhen and R & D centers in Xi'an and other places. The company's products include intelligent cellular communication solutions for the Internet of Everything and future - oriented edge - side AI solutions.

RevoMicro Semiconductor positions itself in the innovation and application of advanced semiconductor packaging technologies. After years of dedicated R & D, the company has developed over 30 innovative materials and core patented technologies for advanced semiconductor packaging, creating an advanced packaging technology platform suitable for various industries and products. It introduced chemical I/O bonding into the advanced semiconductor packaging industry for the first time, using reverse additive manufacturing to achieve an integrated process of semiconductor chip bonding, wiring, and module mounting, solving industry pain points in semiconductor packaging, improving product reliability, and significantly reducing production costs.

Rigoron is a provider focusing on the R & D and local services of EDA sign - off tools for digital chip backend design. The company's products have complete independent intellectual property rights. The founder is a serial successful entrepreneur in this field, and the core R & D personnel have doctoral degrees and experience in international companies. The company's vision is to become the leader of fully domestic digital backend full - process EDA tools, reaching and exceeding international standards.

Linkage of "Investment, Loan, and Insurance" Empowers; Platform Achievements Continue to Stand Out

Since its launch in March this year, the regular theme roadshows of X - Day on the first Thursday of each month have been successfully held seven times. From the start until now, the platform has received 185 project applications, connected 102 enterprises with over 2000 investment institutions, with a cumulative financing amount of over 360 million yuan, bank credit of over 100 million yuan, and successfully launched the first science and technology insurance policy, providing 3 million yuan of product protection for enterprises, truly realizing the linkage and empowerment of "investment, loan, and insurance".

During this event, a sub - venue of the "M&A Action Camp" in Nanshan District was also held simultaneously, conducting closed - door connections for eight listed companies in the semiconductor and integrated circuit fields in Nanshan District and ten industrial financing and M&A projects from across the country, building an innovative platform with dual - wheel drive for industrial upgrading and capital cooperation!

See You in October, Focusing on the New Track of "AI Model Power Camp"

In a warm atmosphere of connection, this roadshow event came to a successful conclusion. X - Day will continue to build an open, precise, and efficient science and technology finance ecosystem platform around strategic emerging industries. On the first Thursday of each month, meet at X - Day in Xili Lake. The special event of the AI Model Power Camp project in October is in intensive preparation. Now, high - quality projects are being recruited nationwide! We welcome investors to reserve time, as there are excellent projects waiting for you here!

Please continue to follow the X - Day Xili Lake Roadshow Society. You can view event announcements and sign up through the Ai Nanshan Mini - Program - "Find Funds" - Xili Lake Roadshow Society Section.

On October 9th, at the X - Day AI Model Power Camp project special event in Xili Lake, see you there!