Chip packaging equipment R & D company "Weijian Intelligence", which has completed three phases of capacity expansion and has an annual production capacity of 600 die bonders, has received over 100 million yuan in Series B financing | Exclusive from 36Kr

Text | Zhang Bingbing

Editor | A Zhi

36Kr learned that Microsee Intelligent Packaging Technology (Shenzhen) Co., Ltd. (hereinafter referred to as "Microsee Intelligent") recently completed a Series B financing of over 100 million yuan. New investors include Qianhai Financial Holdings, Mingzhi Venture Capital, and Lihe Science and Technology Innovation. Existing shareholders Haitong Kaiyuan and Fenxiang Investment participated in follow - on investments. Shendu Capital continued to serve as the exclusive financial advisor for this round. The funds will be mainly used for product R & D, and greater efforts will be made in R & D and product layout in the future advanced packaging directions such as transmission, storage, and computing in the AI era.

Founded in December 2019, "Microsee Intelligent" focuses on the R & D and production of high - precision and complex - process chip packaging equipment. Its main products are the MV series of high - precision die - bonding equipment, which support the packaging process requirements of third - generation semiconductor chips (gallium nitride, silicon carbide). It is a key equipment for the packaging of core chips in fields such as optical communication, 5G radio frequency, commercial lasers, high - power IGBT devices, and storage.

From 2023 to 2024, "Microsee Intelligent" successively won orders from leading domestic and foreign optical module customers, and its revenue has been growing at a double - digit rate year after year. In July 2025, "Microsee Intelligent" completed the expansion of its Phase III delivery center. After putting into production, it will achieve a production capacity of 600 die - bonding machines.

I. The Technology and Timing of the "Rise of Domestic" Die - Bonding Machines

Die - bonding is the first and decisive step in the packaging process. The workflow of a die - bonding machine is a highly precise automated process: it picks up tiny bare chips, identifies and calibrates their positions through a high - precision vision system, precisely mounts the chips on the substrate according to the designed position, and bonds them through methods such as silver glue or solder.

The accuracy of die - bonding directly determines the product performance. In optical communication modules, the alignment between the laser chip and the optical fiber must be within micrometers. If the accuracy of the die - bonding machine is insufficient and the optical path is misaligned, the signal transmission efficiency will drop sharply or even fail completely. Therefore, accuracy is the first technical threshold for die - bonding machines to cross.

Once, the accuracy of domestic die - bonding machine products was all >10μm, and the high - end market within 5μm was monopolized by international leading manufacturers such as those from the United States and Japan. Benchmarking against global leading products, "Microsee Intelligent" R & D and produces a series of high - precision die - bonding machines with a level of 1.5μm. Currently, the equipment can control the total error within 1.5μm, and the actual mass - production mounting accuracy of chip products reaches ±3μm, and the mounting force control accuracy is better than 10g±1g.

Die - bonding machine of "Microsee Intelligent"

However, technological breakthrough does not mean rapid market penetration. The 1.5μm series products of "Microsee Intelligent" were successfully developed in 2020 and entered the market in 2021. Lei Weizhuang, the CEO of "Microsee Intelligent", admitted that the market was not easy to break into at that time. "Before 2022, we were in great pain. The equipment was ahead of its time, but customers thought it was expensive."

At the end of 2022, the explosion of AI brought a turning point to the market. The explosion of AI demand significantly drove the market demand for optoelectronic transmission chips and put forward higher requirements for dedicated die - bonding machines. To improve efficiency, die - bonding machines need to maintain high precision and stability at high - speed operation, which puts extremely high requirements on motion control, visual positioning, and vibration reduction technology.

"Microsee Intelligent" seized the opportunity of AI computing power. "In 2022, we completed the verification of some benchmark and seed customers. When the demand came in 2023, we just caught up with the timing. If we had started the R & D a little later, we would have missed the first wave and the first round of domestic substitution." In Lei Weizhuang's view, if they couldn't enter the market in the first round, the opportunity of "domestic substitution" would easily turn into competition of "substituting domestic products".

In recent years, more enterprises in the industry have entered the competition of 10μm - level products, but Lei Weizhuang believes that there are still gaps in the core performance of the whole machine among peers. "The technology in domestic whole - machine and engineering aspects may progress rapidly, but for our kind of equipment, the progress of the underlying technology of mechanical motion control is actually not fast. The ability of core components we have mastered has not been caught up by our peers."

Facing competition, on the one hand, "Microsee Intelligent" broadens its product line. In terms of accuracy, it expands upwards to sub - micron - level products of 0.5μm and downwards to 10μm - level products to broaden the market space; on the other hand, it expands across industries. In response to the demand for transmission, storage, and computing chips driven by AI, 5G, and big data, it develops new products to create a second growth curve.

II. From Performance and Efficiency Improvement to Solution Optimization

The explosive growth of AI computing power has put forward multi - dimensional and strict requirements for advanced packaging technology. In addition to consolidating its advantages in the optical communication field, "Microsee Intelligent" accelerates the layout in the storage and computing directions, creates a product matrix of "transmission, storage, and computing" to meet the requirements of advanced packaging for AI chips in terms of computing power stacking, high memory bandwidth, increased interconnection density, and heterogeneous integration.

In actual market applications, the mass - production capacity and performance efficiency of die - bonding machines are particularly important because the value of chips has been highly accumulated in the front - end processes, and packaging failure means a waste of all previous investments.

When summarizing the greatest progress of "Microsee Intelligent" in the past two years, Lei Weizhuang believes it is the mass - production capacity of its equipment: "What we have done the most and improved the most is the mass - production performance on the customer production line. Our equipment not only has high precision but also high utilization rate, high yield rate, and low manual intervention rate, which means stability and high efficiency. Mass - production customers have very high requirements for efficiency, and efficiency is their money."

It is reported that the equipment of "Microsee Intelligent" can be put into mass production without the presence of the original factory personnel. After the equipment is shipped to the customer site, the customer can start mass production after two or three days of debugging. And because the equipment rarely breaks down, after - sales service does not require the presence of the original factory personnel. Lei Weizhuang summarized it as "put into production in 3 days, 0 on - site delivery by the original factory", achieving optimization from performance and efficiency to the entire solution.

Currently, "Microsee Intelligent" has served 7 out of the top ten global optical device manufacturers and optical module customers, and it is expected to maintain a growth rate of 60% - 100% in the next two years.

In 2023, "Microsee Intelligent" exported its 1.5μm - level high - precision die - bonding machines to the European and American markets. Currently, focusing on key chip markets such as East Asia, Southeast Asia, and the United States, "Microsee Intelligent" is deploying an overseas delivery system, building a local team, and has local delivery and technical support capabilities. Export orders account for more than 20% of the total.

Due to the growth of market demand, the expansion of the Phase III delivery center of "Microsee Intelligent" was completed ahead of schedule and put into production in July. The construction of the Phase IV production line is in progress. In the future, it will improve the product matrix in the advantageous optical communication field, increase R & D investment in products of the second growth curve such as "transmission, storage, and computing", and achieve a commercial closed - loop of the new growth curve.

This article is from the WeChat official account "36Kr Future Industries". The authors are Zhang Bingbing and A Zhi. It is published by 36Kr with authorization.