Shenzhen University Professor Ventures into Active Cooling for AI Chips, "Ruimeng Semiconductor" Secures Tens of Millions in New Financing | Exclusive Report by Hard Krypton

Author: Ou Xue

Editor: Peng Xiaoqiu

Yingke has learned that Shenzhen Ruimeng Semiconductor Co., Ltd. (hereinafter referred to as "Ruimeng Semiconductor") recently received tens of millions of yuan in pre-A+ round investment from Yida Capital and Hechuang Capital, with Yuewei Capital serving as the exclusive financial advisor. This is the third round of financing that "Ruimeng Semiconductor" has obtained within a year, and the annual financing scale is approaching 100 million yuan. The financing funds will be mainly used to establish a product pilot platform and supplement R & D funds.

Founded in 2020, "Ruimeng Semiconductor" is accelerating the large-scale commercialization of active cooling microsystems for intelligent terminals and high-computing-power chips. It is a rare vertically integrated microsystem solution provider in China, having built a complete technological closed-loop of "materials - devices - chips - algorithms".

Yingke has learned that Li Bing, the founder & CEO of "Ruimeng Semiconductor", is a doctor from the Chinese University of Hong Kong, a researcher at the School of Electronics and Information Engineering of Shenzhen University / National Key Laboratory of RF Heterogeneous Integration, and a doctoral supervisor. He has been engaged in in - depth research in the fields of piezoelectric MEMS sensors and actuator microsystem chips for nearly two decades, and has presided over more than 10 scientific research projects, including national key projects, general projects of the National Natural Science Foundation, and sub - projects of the national key R & D plan of the Ministry of Science and Technology.

In recent years, with the explosion of computing power in AI terminals, heat dissipation has gradually become a key bottleneck for performance release. Take the flagship model equipped with the third - generation Snapdragon 8s processor as an example. Its NPU computing power reaches 50 TOPS, and the power density increases by 40% year - on - year. When running generative models such as Stable Diffusion, the collaborative power consumption of the CPU and GPU instantly exceeds 8W, and the body temperature soars to 45°C within 15 minutes, triggering forced frequency reduction, resulting in glitches in functions such as real - time AI processing and voice interaction.

This is also the reason why "Ruimeng Semiconductor" targets the heat dissipation track. "From the perspective of market demand, due to the rise of large AI models, the heat dissipation needs of chips on both the cloud and terminal sides are extremely urgent," said Li Bing.

In addition, Li Bing emphasized that the future of chip heat dissipation lies in active heat dissipation technologies at the package - level and wafer - level. In the mechanical fan solutions used in the early stage, although they can provide a certain amount of heat dissipation capacity, they face pain points such as conflicts between space occupation and thin - and - light design, short - comings in reliability and lifespan, and poor noise experience. Therefore, these pain points make it difficult for mechanical fans to be adapted to emerging terminals such as ultra - thin mobile phones with a thickness ≤ 7mm and AR glasses. The industry urgently needs more miniaturized and reliable active heat dissipation solutions.

Yingke has learned that the MagicCool cooling micropump product of "Ruimeng Semiconductor" has achieved a breakthrough balance between millimeter - level thickness and industrial - grade heat dissipation efficiency. It is a full - stack heat dissipation solution based on piezoelectric MEMS technology and compatible with existing semiconductor and advanced packaging processes. Through high - frequency piezoelectric vibration, it drives the flow of gas or liquid, thereby achieving efficient heat dissipation.

In terms of specific performance indicators, this product has a flow rate of 2 L/min, a power consumption of 200 mW, a back pressure of 420 Pa, and a heat transfer coefficient of 330 W/(m^2*K) under the size of 100mm2*2mm, leading in key indicators. "Currently, the company has carried out in - depth cooperation on mass - production projects with several leading terminals and is about to achieve mass shipments," Li Bing revealed.

Therefore, overall, Li Bing believes that the heat dissipation products of "Ruimeng Semiconductor" have five competitive advantages: First, the team has a design methodology for multi - physical - field collaborative modeling and simulation; Second, the unique cavity and flow - channel design features low flow resistance and high flow rate per unit area; Third, self - developed piezoelectric ceramic materials and devices ensure core performance and reliability; Fourth, customized SoC chips reduce size and cost; Fifth, relying on a strong supply chain and the manufacturing advantages of the Greater Bay Area, the products are more cost - effective.

Views of the investors:

Yao Bo, Investment Director of Yida Capital: As the penetration rate of large AI models in end - side devices continues to increase, the heat dissipation problem has become a common concern in the industry and a core pain point that needs to be solved urgently. Existing passive heat dissipation solutions can no longer meet the sharply increasing heat dissipation requirements. The Ruimeng team has provided an innovative piezoelectric cooling microsystem for customers based on years of accumulation in piezoelectric ceramic devices. Compared with existing heat dissipation solutions, it has achieved a leap - forward improvement in terms of size and heat transfer efficiency, and is expected to lead the future development trend of heat dissipation systems.

Liu Huarui, Vice President of Hechuang Capital: The development of the electronic information industry always has the requirements of high performance, miniaturization, and low power consumption. The actuator - sensor system based on piezoelectric ceramics of Ruimeng perfectly meets these requirements, especially in the field of heat dissipation after the rise of AI. Ruimeng will have urgent applications in fields such as AI, intelligent monitoring, intelligent vehicles, and high - end 3C electronics. These changes in downstream demand bring new opportunities for technological upgrading and growth. Just as the sensor and actuator microsystem technology, as the core technology in the era of intelligent vehicles, the market is growing exponentially. The track that Ruimeng is in is not about domestic substitution; it can drive the global upgrade of the electronic information industry. We are very confident that Ruimeng will grow into an internationally leading all - around high - end heat dissipation solution company based on full - stack piezoelectric system technology.