High-density DTC silicon capacitors go into mass production and hit the market —— Morimaru Electronics launches a series of chip capacitor products
01. Silicon Capacitor: A Revolutionary Breakthrough in Passive Electronic Components
The silicon capacitor uses a single - crystal silicon substrate. Through deep - trench etching technology, a three - dimensional microstructure is constructed on the silicon wafer, and then a high - purity dielectric layer is achieved through a series of thin - film deposition and etching processes. This innovative design that integrates semiconductor manufacturing processes has brought a qualitative leap in capacitor performance:
· Excellent capacitance stability: The capacitance drift caused by temperature, bias voltage, and aging characteristics is less than 1/10 of that of MLCCs;
· Ultra - thin form: It can achieve an ultra - thin thickness of less than 50 microns, even less than the diameter of a hair;
· Ultra - high density: The capacitance per unit area is increased by more than 10 times;
· Extremely low ESL and ESR: Ensure signal integrity and reduce power supply noise and impedance.
Traditional MLCCs use the ceramic powder stacking and sintering process, which has inherent deficiencies: micro - cracks are prone to occur between ceramic layers, internal stress accumulates due to high - temperature sintering, and the multi - layer structure brings high parasitic inductance. The single - crystal silicon substrate of the silicon capacitor has a highly ordered atomic arrangement and no grain boundary defects, fundamentally solving these pain points.
The silicon capacitor is not a simple improvement of MLCCs but a fundamental technological innovation based on semiconductor processes. Its advantages are reflected in multiple dimensions, directly solving the long - standing "hidden compromises" of MLCCs in high - performance applications. In high - end fields such as 5G/6G communication, power distribution networks (PDN) of high - speed processors (such as AI, HPC), automotive electronics (such as ADAS, BMS), and medical devices (implantable and in - vitro diagnostics), silicon capacitors are rapidly replacing traditional MLCCs. By reducing the number of required components or improving the overall system reliability, they have become the "performance heart" of the new - generation electronic systems.
02. The Development Trend of Electronic Products Drives Capacitors to Break Performance Boundaries
Under the trend of thinner and lighter terminals, capacitors are developing towards "five highs and one small": "Five highs": high capacitance, high frequency, high temperature resistance, high voltage resistance, and high reliability; "One small": miniaturization, that is, the proportion of small sizes such as 0201 and 01005 is increasing.
· 5G/6G Communication
After the communication bandwidth moves towards high frequencies, the loss in the signal path becomes unacceptable, which requires capacitors to have a higher Q value and a higher SRF (self - resonant frequency). At the same time, in order to be integrated into antenna arrays and miniaturized modules (such as AiP), the requirement for capacitor miniaturization has reached the extreme. Sizes of 01005 and even smaller 008004 have become the focus of research and development.
· Automotive Electronics
Applications such as ADAS, LiDAR, in - vehicle infotainment, and powertrain electrification not only require a large number of capacitors but also put forward strict requirements for reliability, high - temperature resistance (- 55°C to + 250°C), and high - voltage resistance.
· High - Performance Computing (HPC) and AI Data Centers
The power demand of the new - generation CPUs, GPUs, and AI accelerators is increasing exponentially, and the design of their PDN power supply networks faces huge challenges. In order to provide stable and clean power for these high - power - consumption chips, the most advanced power integrity solutions are needed. This directly drives continuous innovation in ultra - low ESL (such as IDC, LGA) and ultra - high capacitance density capacitors. It is also one of the key driving forces for the development of next - generation packaging technologies such as CPO.
03. Morimaru Electronics Launches Multiple Mass - Produced Silicon Capacitor Products with Performance Comparable to International Giants like Murata
The Morimaru Electronics team has been deeply involved in the industry for more than a decade, committed to promoting the era of comprehensive passive integration. It is the first domestic innovative enterprise to master the full - chain technology of silicon capacitor design and manufacturing. Currently, multiple silicon capacitor products based on the Morimaru platform have been mass - produced and delivered to leading customers, with hundreds of millions of silicon capacitors delivered in total.
1) Trench Silicon Capacitor DTC
Developed and prepared based on Morimaru's high - density capacitor process platform, it uses semiconductor process technologies such as deep - silicon etching, thin - film deposition, and patterning. Morimaru's DTC capacitors have advantages such as high capacitance density, high voltage resistance, low parasitics, and high stability and reliability, and are widely used in fields such as radio - frequency circuits, power supply voltage regulation, and optical communication.
Application Fields
Due to its excellent electrical performance, such as low ESR, ESL, and insertion loss, as well as excellent frequency stability, DTC capacitors are mainly used as decoupling capacitors in the PDN power supply networks of high - speed transceiver modules (DSP, SerDes, Driver, PA) and coupling capacitors for signal lines in the optoelectronic field. These high - power - consumption and extremely high - speed application scenarios have extremely strict requirements for power supply stability, cleanliness, and signal integrity, requiring extremely low impedance and insertion loss to reduce the impact of noise on signal transmission and improve the signal - to - noise ratio and stability of the signal.
Schematic diagram of DTC silicon capacitor application in optical communication
Main Parameters
Taking SWAK0505A/B1R0 as an example, the specific devices may vary. For details, please query the Morimaru Electronics official website
Product Capacitance Table
Typical Product Parameters
Temperature drift test curve and DC bias test curve (SWAK0505A/B1R0)
ESR test curve and capacitance - frequency characteristic curve (SWAK0505A/B1R0)
2) MIM Surface - Mount Silicon Capacitor
The SW - MIM silicon capacitor uses planar thin - film deposition and patterning processes. The thin - film process gives it high precision and good frequency characteristics, with advantages such as high precision, small volume, low temperature - drift coefficient, and high stability.
Application Fields
The small - volume advantage of MIM capacitors is suitable for high - density integration. The low temperature - drift coefficient ensures that the capacitance value changes little in different temperature environments, guaranteeing the stability of circuit performance. It is widely used in radio - frequency matching circuits, etc.
Schematic diagram of MIM capacitor application in radio - frequency circuits
Main Parameters
For more specific performance, it varies according to the device model. Please query the Morimaru Electronics official website
Product Capacitance Table
3) MIS Silicon Capacitor
Developed and prepared based on Morimaru's high - precision capacitor process platform, the metal - insulator - semiconductor structure gives it high voltage resistance and high stability. It is suitable for wire - bonding and other assembly processes, can be well compatible with various semiconductor devices, and is widely used in fields such as radio - frequency circuits and optical communication.
Application Fields
The SW - MIS silicon capacitor has advantages such as high precision, small volume, low temperature - drift coefficient, and high stability. It is widely used in systems that need to block DC or for radio - frequency bypass (coupling), filters, oscillators, and matching networks. The small - volume advantage is beneficial to system integration.
Schematic diagram of DC Blocking application
Main Parameters
For more specific performance, it varies according to the device model. Please query the Morimaru Electronics official website
Product Capacitance Table
4) Glass Capacitor
The SW - GMIM capacitor is developed and prepared based on Morimaru's high - precision glass process platform, using semiconductor process technologies such as TGV, planar thin - film deposition, and patterning. The glass substrate has better mechanical stability and lower electrical loss, can be applied in higher - frequency fields, and is suitable for combined applications with MIM capacitors. The glass MIM capacitor has a high breakdown voltage, a high Q value, and high stability. The product uses TGV to connect the back - side metal to ground and adopts a wire - bonding pad structure, which is convenient for wire - bonding applications.
Application Fields
The SW - GMIM capacitor has advantages such as high precision, small volume, low temperature - drift coefficient, and high stability, and is widely used in radio - frequency matching circuits and optical communication, etc.
