"Hengwan Technology" has completed a Series B financing of hundreds of millions of RMB.

36Kr has learned that Hengwan Technology (ZILLNK) recently announced the completion of a Series B financing of several hundred million RMB. This round is led by Shenzhen Venture Capital, with participation from CDB Science & Technology Innovation, Wofu Venture Capital, Dongshan Precision and other investors. The raised funds will be mainly used for independent R&D of core chips, R&D of AI-RAN and 6G technologies, as well as the in-depth deployment of overseas markets.