Entdecken Sie SEMICON 2026! Hier kommen die Highlights der chinesischen Geräteindustrie - Kette.

From March 25th to 27th, SEMICON China 2026 will be held at the Shanghai New International Expo Center. As the leading semiconductor industry event in the Asia - Pacific region, this exhibition has attracted over 1,500 exhibitors and 180,000 professional visitors. The theme of the exhibition is "Boundless globally - Hearts and chips connected". When strolling through the exhibition halls, it is noticeable that the collective presence and technological implementation of Chinese companies in the semiconductor device value - added chain have become the most - watched content of this exhibition. A less obvious narrative layer emerges - the Chinese semiconductor device value - added chain is evolving from "individual breakthroughs" to a "network - like coverage".

In recent years, the "breakthroughs in lithography equipment" and the "mass production of advanced process technologies" have been in the spotlight. However, what truly supports the entire process from chip development to mass production includes not only these aspects but also the testing and measuring instruments for research and development verification, the core equipment such as etching and deposition equipment in the mass - production phase, the bonding equipment in the packaging phase, and the key components that ensure the stable operation of the equipment. More than 90% of these tools were once import - dependent. At this exhibition, a number of domestic companies announced with their technological achievements that this situation is changing.

01 Testing and Measuring - the "Eyes" of Chip Development

In the semiconductor value - added chain, the testing and measuring instruments are the "eyes" of chip development. At SEMICON China 2026, a number of domestic testing and measuring companies presented their breakthroughs.

The performance and function verification before chip design and prototype development highly depend on high - quality electronic testing and measuring instruments. This area has long been monopolized by international corporations such as Keysight Technologies. More importantly, the delivery time and after - sales service of high - performance equipment often depend on others.

At this exhibition, in addition to the previously presented 90 - GHz ExWave - TS series of high - speed real - time oscilloscopes, Wanliyan presented a new 110 - GHz spectrum analyzer. The core breakthrough of the newly presented 110 - GHz spectrum analyzer focuses on two key criteria - higher frequency capability and wider analysis bandwidth. Thanks to the continuous progress in high - frequency technology and chip groups, the Wanliyan spectrum analyzer has not only achieved continuous coaxial coverage from 2 Hz to 110 GHz but also overcome the fixed limitation of "the higher the frequency, the worse the performance". It has achieved positive improvements in terms of higher frequency, wider usable analysis bandwidth, and better measurement dynamics, which strengthens the measurement foundation for the development of high - frequency communication, sensors, and core components. The Wanliyan 110 - GHz spectrum analyzer has an enormous analysis bandwidth of 8.4 GHz and the highest real - time analysis bandwidth of 2 GHz in the industry, which is nearly 400% higher than the Wassenaar Export Control levels. This is particularly important for the analysis of 5G broadband modulation signals, 6G communication, and transient signals in complex electromagnetic environments.

After chip manufacturing, the control of yield, function, and reliability verification on the mass - production side is impossible without the support of automatic test equipment (ATE). This market has long been monopolized by the two international manufacturers Advantest and Teradyne, and the localization process could not achieve significant breakthroughs for a long time. With the strong demand for domestic equipment in the Chinese chip industry, domestic ATE manufacturers have quickly gained importance and achieved decisive breakthroughs.

Changchuan Technology presented two digital test machines, the D9016 - P16 and the D9016 - P08. The D9016 - P16 supports a maximum of 4096 digital I/O channels and is designed for complex high - density, high - precision, and high - parallelism application scenarios. It features a flexible machine configuration, high test efficiency and parallelism comparable to high - quality SoC test machines of foreign manufacturers, and mature software debugging tools. Since 2021, it has been widely used in the mass production of complex SoC chips. It is suitable for mass - production tests of network processors, digital baseband processors, mobile phone PMICs, network processors, high - quality microprocessors, memory controllers, audio and video processors, and other chips.

Yuexin Technology presented a memory chip testing system, the TM8000. The system can configure a maximum of 32 digital channel boards, where the digital channel boards have up to 10240 channels (IO/DR). The maximum output waveform rate is 400 Mbps. It supports up to 3072 DUT wafer - parallel tests and the parallel connection of channels. The maximum current per board is 96 A, and it can be connected in parallel across boards.

Taitan Testing exhibited a series of products such as memory chip ATE test machines, BI aging test machines, SLT test machines, SSD module test equipment, and DDR module test equipment. These products cover all test steps from memory wafers, chips to modules and contribute to the localization of test equipment in the DRAM and NAND Flash fields. Taitan has also conducted research on key materials and tools for semiconductor testing and can provide customers with comprehensive test equipment supply and maintenance services. According to information, Taitan Testing received an investment of 100 million yuan from the strategic investment company Changcun Industrial Investment Fund, which corresponds to a share of 16.34%, and is the second - largest shareholder. (To learn more about the technological strategy and development prospects of Taitan Testing, see "Interview with Dr. Xu Yonggang, CEO of Taitan Testing: The restructuring of the memory test equipment industry starts again").

Information from the exhibition shows that domestic test equipment has achieved certain technological breakthroughs in the two core markets of SoC and memory, which have high technological barriers. Compared with international manufacturers, domestic companies also have significant advantages in the supply chain. Employees of Changchuan Technology revealed that the delivery time of foreign equipment manufacturers is generally more than six months, while domestic equipment can be delivered quickly within two months, which can more efficiently meet the mass - production requirements of domestic customers.

02 Process Equipment - the "Deep Areas" of the Value - Added Chain

Testing and measuring are only part of the semiconductor device value - added chain. In the field of process equipment, the localization process is also accelerating. Core equipment for wafer manufacturing such as etching equipment, deposition equipment, and epitaxial equipment are the difficult areas in the implementation of the semiconductor industry. At this exhibition, the booths of domestic market leaders such as AMEC and Naura were very popular, and both presented important new products and technological upgrades.

Naura presented several new products, including a new 12 - inch NMC612H Inductively Coupled Plasma (ICP) etching equipment, a 12 - inch Qomola HPD30 Hybrid Bonding equipment, a Deep Aspect Ratio TSV Electroplating equipment (ECP) Ausip T830, and others. The NMC612H ICP etching equipment has increased the aspect ratio in ICP small - format etching to several hundred to one and brought the uniformity into the era of Angstrom accuracy. The HPD30 Hybrid Bonding equipment focuses on the extreme requirements for chip interconnectivity in all application areas of 3D integration such as SoC, HBM, and Chiplet and is the first Chinese manufacturer to complete the process verification of the D2W Hybrid Bonding equipment at customers. The Ausip T830 has made the leap from "automated execution" to "self - adaptive manufacturing" by integrating AI into the equipment and provided a systematic solution for the problem of filling deep - aspect - ratio structures in advanced packaging. At the same time, Naura has integrated the technological strengths of Xinyuanwei to address the process challenges in advanced logic, advanced memory, and three - dimensional stacking and complete the global reconstruction of wet - chemistry ecosystems. The coverage of the entire wet process is over 97%, and an industry - leading system for high - quality solutions for the entire wet process has been established.

AMEC held a new - product press conference at the exhibition and presented four new products at once: a new Inductively Coupled ICP Plasma Etching equipment Primo Angnova, a High - Selectivity Etching equipment Primo Domingo, a Smart RF Match - intelligent RF matcher, and a MOCVD equipment Preciomo Udx for the mass production of blue - green Micro - LEDs. The introduction of the Primo Angnova provides an independent, controllable, and technologically leading ICP etching process solution for the manufacturing of logic chips of 5 nanometers and below and advanced memory chips with similar technological difficulties. The introduction of the Primo Domingo fills the gap in the independent manufacturing of the key etching process for the next - generation 3D semiconductor devices in China. Notably, AMEC also participated in the exhibition together with the recently acquired Zhonggui Technology. Zhonggui Technology presented its CMP equipment, which further completes the entire chain of key process steps in wafer manufacturing for AMEC.

Tuojing Technology presented high - quality equipment such as the Volans 300 3D IC, a precise repair equipment to solve the problem of voids at the bonding interface, a Low - Dielectric Thin - Film equipment PF - 300L Plus nX PECVD, a PEALD Atomic Layer Deposition equipment VS 300 Astra - s SiN, and a Chip - on - Wafer Fusion Bonding equipment.

Huahaiqingke presented its entire series of advanced semiconductor equipment and process integration solutions, including the CMP equipment Universal - 300T, a Thin - Grinding and Polishing All - in - One equipment Versatile - GP300, a Wafer Edge Processing equipment Versatile - DT300, a Large - Beam Ion Implantation equipment iPUMA - LE, and others.

Jingsheng Electromechanical presented a three - dimensional product system with solutions for the 12 - inch large - silicon - wafer value - added chain, solutions for connections, solutions for the entire process of square silicon wafers, and solutions for the entire series of thin - grinding equipment. For the field of advanced packaging, it has developed a 12 - inch W2W high - precision bonding equipment specifically for 3D integration and advanced semiconductor packaging. It combines all process modules and has good properties such as high alignment accuracy and high productivity. The simultaneously presented SOI Bonding and Picosecond Laser Engraving equipment can meet the requirements for the manufacturing and processing of high - quality wafers. Notably, the presented solution for the entire process of square silicon wafers provides a complete series of self - developed equipment from crystal growth to testing and has achieved the technological leap from traditional round wafers to rectangular substrates, which provides a practical industrial way to solve the bottlenecks in area utilization and packaging efficiency in advanced packaging.

From the product strategies of individual manufacturers, it can be seen that in addition to continuously dealing with the core processes of advanced process technologies, advanced packaging has become a core market for domestic equipment manufacturers. In particular, bonding equipment is the core area that market leaders focus on. In addition, domestic market leaders generally have introduced a platform - oriented development strategy and shifted from the development of individual equipment to an overall solution covering all process steps and adapting to all scenarios.

03 The Breakthrough of Key Components of Semiconductor Equipment

In the industrial development process of the semiconductor device value - added chain, not only core equipment and software companies but also semiconductor device components, which serve as the foundation of semiconductor devices, support the development of the equipment industry. The manufacturing of key components in the semiconductor industry is also an area with high difficulty and high technological content. Although they are not directly involved in chip manufacturing, they are still of crucial importance for domestic equipment. At this exhibition, a number of domestic component manufacturers presented their latest implementation results and gradually integrated into the main supply chain of domestic equipment.

AMEC not only presented new equipment but also a key subsystem, the Smart RF Match - intelligent RF matcher, for high - quality semiconductor etching equipment. The Smart RF Match - intelligent RF matcher is used to ensure the stable generation and control of plasma in the equipment chamber. It is specifically designed for pre - fabrication processes in the semiconductor industry, especially for dielectric etching, silicon etching, metal etching, and precision etching in advanced packaging, MEMS, and compound semiconductors. It has introduced the concept of an RF network in the semiconductor equipment industry for the first time and enables the real - time and accurate transmission of RF state information between the RF power source and the intelligent matcher via EtherCAT. Thus, the intelligent matcher can act as an active device and send control commands to the RF power source during the adjustment of the matching network.

Qier Electromechanical presented its LP series of magnetic bearing pumps, BD series of dampers, BP series of bellows pumps (