Deutschlandweit erster: Hochwertiger Anbieter für Halbleiterverkapselung erhält mehrere Millionen Yuan an Finanzierungen aus Zhejiang | Exklusivbericht von Yingke

Text | Hu Yiting

Redaktion | Yuan Silai

Hard Kr has learned that recently, the semiconductor packaging equipment manufacturer Corell Technology (hereinafter referred to as "Corell") announced the completion of a Series A+ financing of tens of millions of yuan. The investor is Zhejiang Venture Capital, and the funds will be used for product R & D and working capital replenishment. In the same year, it also received strategic financing from CRRC Capital.

Corell was founded in 2014. Focusing on medium - and high - power IGBT/SiC module packaging equipment, it provides full - line solutions. More than ten core products, such as high - precision chip mounters, fully automatic micron - level pin inserters, and SiC flip - chip bonding equipment, are all developed through in - house R & D, and the core technologies are independently controllable.

The IGBT/SiC module is a fully controlled voltage - driven power semiconductor device with excellent characteristics such as low energy consumption and high power. It is widely used in industries such as 5G communication, aerospace, new energy vehicles, and smart grids.

The global market for the packaging and testing of power semiconductor modules is also continuously growing. According to Yole data, it is estimated that the global packaging and testing market will reach 89.9 billion US dollars in 2024, a year - on - year increase of 5%. In 2026, the global packaging and testing market is expected to reach 96.1 billion US dollars, and the advanced packaging market will reach 52.2 billion US dollars, accounting for 54%.

In 2021, Corell developed domestic energy - storage - grade and automotive - grade IGBT module packaging equipment, which can package IGBT/SiC chips into modules with specific functions and performance to meet the flexible needs of different customers in different scenarios. The company has a variety of core products. Among them, the TP - 3000 - HG series high - speed chip mounter is designed for the high - speed mounting of SiC module chips. With a modular design as a whole, it can achieve a mounting accuracy of less than 3 microns and support the mounting of 6 - inch, 8 - inch, and 12 - inch chips.

High - speed chip mounter, image source: the enterprise

The pin inserter is designed for the high - speed pin insertion of silicon - based and SiC modules. Using high - precision 3D vision inspection, it can achieve a pin - insertion accuracy of 1 micron and is compatible with straight pins, fisheye pins, and special - shaped pins.

Pin inserter, image source: the enterprise

Many of Corell's products are widely used in emerging industries such as smart consumer electronics, wind power, energy storage, electric vehicles, and high - speed railways. At present, it has served nearly a hundred high - quality domestic and foreign customers in the industry, successfully delivered more than 30 intelligent packaging lines, and the yield rate of the full line is over 99%. Among them, the coverage rate of the company's top customers is 50%, and its current market share reaches 10%, ranking first among domestic full - line suppliers.

Corell's revenue has doubled in the past three years. In the next three years, while continuing to expand in the semiconductor packaging industry, the company will also strengthen cooperation with well - known manufacturers, integrate advanced technologies such as large AI models and digital twins, enrich its product line, and enter high - end markets such as advanced packaging, intelligent medical care, and automotive electronics.

Investor's view:

Hu Yongxiang, General Manager of Zhejiang Venture Capital, said: "The founding team of Corell has been deeply involved in the semiconductor packaging field for more than 10 years. With excellent technical strength, keen market insight, and high - quality customer service capabilities, they have successfully developed core process equipment and full - line solutions for power devices and modules such as IGBT and SiC. In promoting the localization and full - line automation of semiconductor packaging equipment, Corell has shown great potential and made important contributions. We are honored to participate in this round of financing of Corell and will continue to support it. By deepening industrial ecosystem cooperation, we will inject more resources into the enterprise and jointly contribute to the realization of the goal of domesticating China's semiconductor equipment."